UB-100NM LITHOGRAPHY: MARKET ANALYSIS AND STRATEGIC ISSUES

Chapter 1 Introduction 1-1

1.1 The Need For This Report 1-1

Chapter 2 Executive Summary 2-1

2.1 Summary of Major Issues 2-1
2.2 Summary of Market Opportunities 2-2

Chapter 3 Lithography Issues And Trends 3-1

3.1 Optical Systems 3-1
3.1.1 Introduction 3-1
3.1.2 Step-and-Repeat Aligners 3-8
3.1.3 Deep Ultraviolet (DUV) 3-11
3.2 EUV 3-18
3.5 Nano-Imprint Lithography 3-23
3.4 X-Ray Lithography 3-28
3.3 Electron Beam Lithography 3-34
3.4 Ion Beam Lithography 3-38

Chapter 4 User - Supplier Strategies 4-1

4.1 Determining Lithography Needs 4-1
4.2 Benchmarking a Vendor 4-3
4.2.1 Pricing 4-3
4.2.2 Vendor Commitment and Attitudes 4-5
4.2.3 Vendor Capabilities 4-7
4.2.4 System Capabilities 4-9
4.2.5 Vendor Feedback During Equipment Evaluation 4-9
4.2.6 Vendor Feedback During Device Production 4-11
4.3 Competitive Environment 4-12
4.4 Equipment For Class 1 Cleanrooms 4-15
4.5 Equipment For the Factory of the Future 4-18
4.6 Opportunities 4-19

Chapter 5 Market Forecast 5-1

5.1 Driving Forces 5-1
5.1.1 Technical Trends 5-4
5.1.2 Economic Trends 5-5
5.1.3 Optical Limitations 5-9
5.2 Market Forecast Assumptions 5-10
5.3 Market Forecast 5-11

List of Tables

3.1 Wavelength “Generations” 3-5
3.2 Characteristics of X-Ray Systems 3-29
5.1 Worldwide Capital Spending 5-6
5.2 DRAM Lithographic Requirements 5-8
5.3 Worldwide Optical Stepper Market 5-20
5.4 Worldwide Stepper Market Shares 5-23

List of Figures

1.1 Lithographic Equipment Requirements for DRAMs 1-2
3.1 Lithography Options For MPUs/DRAMs 3-6
3.2 Lithography Options For Flash 3-7
3.3 Illustration of Stepper Exposure System 3-9
3.4 Lens Arrangement For Submicron Features 3-14
3.5 Excimer Laser Evolution 3-15
3.6 EUV Lithography 3-18
3.7 Thermoplastic Nanoimprint Lithography Process 3-23
3.8 Step And Flash Nanoimprint Lithography Process 3-25
3.9 Illustration of X-Ray Lithography 3-30
3.10 Schematic Of Scalpel Electron Beam System 3-34
3.11 Multi-Source E-Beam Lithography 3-36
3.12 Ion Projection Lithography System 3-39
4.1 Manufacturing Costs Per Exposure Station 4-2
5.1 Lithography Market Vs Equipment Market 5-13
5.2 Lithography Double Exposure Technique 5-15
5.3 Lithography Requirements 5-16
5.4 Lithography Extensions 5-17
5.5 Lithography Cost of Ownership 5-18
5.6 Segmentation of Stepper/Scan Shipments 5-21
5.7 Market Shares of Vendors (Units) 5-22
5.8 Unit Market Shares of Vendors 5-24
5.9 Worldwide I-Line Market Shares 5-25
5.10 Worldwide 248nm Market Shares 5-26
5.11 Worldwide 193nm Dry Market Shares 5-27
5.12 Worldwide 193nm Wet Market Shares 5-28
5.13 Market Shares of Vendors (Revenues) 5-30